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Best Electronics has production solutions for:

Chip Scale /Bumped die inspection and packaging

QFN /DFN high volume quality handling

Data Collection, Analysis, and Reporting

Correlation to Customer Test Programs & Devices

Integrated MOSFET Testing

RF Testing

Packaging & Assembly / Engineering Support

New Solutions Offering in 2007-2009

Providing Turnkey Assembly & Test Services (a new 'solution')

Testing Providing Known Good Die ( a new solution)Pecision Temp Sensors (a new solution)

Providing Die Traceability from Wafer to Tape Pocket (new)

Converting Wafer Map Formats (new)

Testing Small QFN / DFN Packages (new) 3x3 , 2x2 mm

We offer tape and Reel service for small CSP die 1x1 mm

"Click" on the Solution you are interested in from the list on the left

Please 'click' on the "Services", "Solutions", "QA/QC ","About Us" or "ic.datacruncher.net" buttons above to open pages describing our technical capabilities in detail.

Click on any of the buttons on the left to access general capabilities and corporate information