• Engineering
• Test Program Development
• Test Program Conversion
• Field Application Engineer
• Customer Program & Device Correlation
• Engineering Support at Customer Facility
• Test Time Reductions
• Board Repair Service
• Equipment Change Kits & Spares In House
• Production
• Tri-Temp Wafer Sort
• Wafer Trimming
• Multi-Site Wafer Sort
• Inkless Wafer Mapping
• Turnkey Assembly
• Wafer Grinding
• Wafer Sawing (Single or dual cuts)
• Package Assembly:
• Lead Free
• Die Attach
• Wire Bonding
• Molding
• Trim & Form
• Marking
• Final Electrical Test - All Temps; Trimming
• QA Testing In-Line
• Package Tape & Reel
• Chip Scale, Bumped Die Inspection
• New QFN/DFN High volume Serivce
• Chip Scale Tape & Reel
• Dry Bagging
• Wafer Pack
• Customer Labeling & Packaging
• Bar Coding
• 100% Data Log All Wafer Sort & Final Tests
• Data Analysis & Histograms in Real Time
• Yield Tracking Reports
• Administrative
• ISO 9001: 9002:, and TS16949 Certified
• Bonded Warehouse
• Tax & Duty Free Importation
• Die Bank Program
• Project Reports:
• Engineering
• Production
• Backlog
• Inventory
• Shipments
• Yield Tracking
• Customer Service 7/24
• 24+ Freight Forwarder Available
• Drop Ship World Wide
• Regular Conference Calls

• Tri-Temp Wafer Sorting
• Chip Scale, Bumped Die - Inspection
• Die Tape & Reel
• Equipment on Order
• Wafer Sorters (EG4\200)
• TMT Testers (ASL-1000 & ASL-3000)
• Handlers
• SOT-23 Laser Marking/Handler
• QFN (MLF, MLP) 6 lead, 3x3 with Kelvin contacts
• Integrated MOSFET insertions
• 4 different insertions merged into one
• 2 handlers on one Tester
• 3608 dual handlers
• 5100 dual handlers
• 4 handlers on one Tester
• Potential of 250K to 350K per day on one tester