• Quick turn bumped wafer service
• you provide the bumped wafer directly from bumping fab
• we provide the tested and taped product… with per die data!

• Our proposed high volume Inkless solution.
• Tri-temp wafer sort
• Wafer Grind and Saw (through subcon)
• Visual inspection and tape packaging
• Data logs and devices drop-shipped to your customer with your label.

• Bumped Wafer Handling and Test
• Test Development on ASL
• Mixed signal and Linear expertise
• Fastest TD turnaround in industry
• Advance wafersort capability
• Up to 200 mm Tri-temp sort on EG4/200
• Controlled low noise environment
• Lowest residual capacitance available
• Rapid correlation process
• Grind and Saw
• Through local Philippine sub-cons

• Triangulated Visual Inspection
• Ink dot inspection
• Die alignment
• Die presence check
• Broken corner
• Scratching
• Cracks
• Voids
• Ball inspection
• Scratching
• Laser marking
• Die orientation ( Pin One )
• Voids
• Cracks
• Tape and Reel
• Supports 0.5 mm die size